Intel Recruitment 2021 OUT – For Development Lead Post | Apply Online!!!

Intel Recruitment 2021 OUT – For Development Lead Post | Apply Online. Intel has invites applications for the post of Semiconductor Packaging Architect / Development Lead Post. Job location is Bangalore, Karnataka, India. Interested candidates can check the eligibility criteria and details then proceed to apply online. Refer this page till end for further details and Online application direct ink also available on this page.

Intel Recruitment 2021 Details

Name of the Board	Intel
Name of the Post	Semiconductor Packaging Architect / Development Lead
Location	Primary Location: Bangalore, Karnataka, India Other Location: Hyderabad, India
Status	Notification Released.

Intel Recruitment 2021 Eligibility criteria

Education Qualification

Master’s degree in electrical/computer engineering with 10+ years of experience or a Bachelor’s degree with 12-15 years of experience; proven and experienced candidates, with strong track record, will be considered.

Experience Required

Candidates should have at least 10+ years of experience in the development of competitive Packages for high speed products like CPUs/ASICs/Chipsets/GPUs; at least, at least 5 years in leading package design work with flip chip interconnects.

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Experience with Package/Board physical design tool – Mentor Expedition and/or Allegro is needed. – Prior experience in using electrical design analysis tools such as Ansoft HFSS, Ansoft Q3D, ADS, HSpice or Sigrity is preferred.

Other Skills

Good knowledge on electromagnetic and microwave theory. – Proven technical program management skills. – Must be data-driven and process-oriented. – Motivated, self-directed, and able to work effectively, both independently and within a team

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Intel Recruitment 2021 Job Description

The Architect is responsible for driving the development of leading-edge Package designs for Intel GPUs; is responsible for leading the design from the planning phase/early pathfinding to the package tape out. It is expected that the Lead has a strong understanding of package technology aspects, covering electrical, power, thermal, mechanical disciplines. Must have proven experience in working with Silicon/IP development, SoC and Platform Architects, Planning, Marketing, and Technology dev teams, and delivering high density flip chip package designs for CPUs/Chipsets/GPUs or similar products.

Intel Recruitment 2021 Disclaimer

Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.

How to apply for Intel Recruitment 2021?

• Go to the Official site of Intel website.
• Select careers section on the Home page.
• Find and select the required notification on the career section.
• Read the Notification and Click Apply Now button.
• Create an account and fill the application form.
• Upload all the required documents and submit it.

Online Application and Notification for Intel Recruitment 2021

Official site

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